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A package-integrated 50W high-efficiency RF CMOS-GaN class-E power amplifier

机译:集成封装的50W高效RF CMOS-GaN E类功率放大器

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A 50 W CMOS-GaN class-E power amplifier in a package is presented. The class-E operated GaN HEMT power bar switches are driven by a high speed, high voltage CMOS power bar driver chip, implemented in a standard 65 nm process technology. The proposed switch-mode power amplifier demonstrates 76% line-up efficiency and 85% GaN drain efficiency at 2.14 GHz, including the losses of the matching network in the package. To the authors knowledge this is the world's first package-integrated CMOS-GaN power amplifier that could enable digital transmitter architectures based on true switch-mode power amplifier blocks.
机译:封装中提供了一种50 W CMOS-GaN E类功率放大器。 E类操作的GaN HEMT功率条开关由高速,高压CMOS功率条驱动器芯片驱动,该芯片以标准65 nm工艺技术实现。拟议的开关模式功率放大器在2.14 GHz频率下具有76%的对准效率和85%的GaN漏极效率,包括封装中匹配网络的损耗。据作者所知,这是世界上第一个封装集成的CMOS-GaN功率放大器,可以实现基于真正的开关模式功率放大器模块的数字发射器架构。

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