Highly miniaturized on-chip RF components employing PPGM with single-sided via holes for application to GaAs MMIC

摘要

In this work, using a microstrip line employing periodically perforated ground metal (PPGM) with single-sided via holes on GaAs MMIC, highly miniaturized and broadband on-chip passive components were developed for application to GaAs MMIC. The passive components employing PPGM were highly miniaturized compared with conventional ones.