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Factors affecting conduction in novel isotropic conductive adhesives filled with silver coated polymer spheres

机译:影响填充有银涂层聚合物球体的新型各向同性导电胶中导电的因素

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Conventionally, ICAs comprise of a high volume fraction of solid silver flakes as a conductive filler in an adhesive matrix, however this paper will focus on newly developed ICAs containing a large volume fraction of metal-coated polymer spheres (MPS) as conductive filler. In our previous studies we have demonstrated the feasibility and benefits of using silver coated polymer spheres as a conductive filler in ICAs, considering their electrical, rheological and mechanical properties, and comparing them with silver flake filled adhesives. In addition, we have also reported the effect of sphere size and coating thickness on their electrical performance. This paper present results from a much more detailed experimental investigation of the effect of various factors on the electrical performance of ICAs filled with Ag coated MPS. These factors are the MPS diameter, the thickness and quality of silver coating arising from different plating processes, the adhesive curing conditions, and the type of adhesive matrix. The experiments have been conducted using Ag coated MPS with the same core material, but diameters of 10μm and 30μm. The results show that the diameter of the MPS has a major effect on the conductivity of the adhesive. The adhesives formulated with smaller (10μm) spheres have nearly twice the conductivity of those with 30μm spheres. For the same size MPS, adhesives containing spheres with a thicker Ag coating show lower resistivity. A significant effect of the adhesive matrix on the resistivity is also observed at filler volume fractions below 48%.
机译:传统上,ICA包含大量固体银片作为粘合剂基质中的导电填料,但是,本文将重点研究新开发的ICA,其包含大量金属包覆的聚合物球体(MPS)作为导电填料。在我们以前的研究中,我们已经考虑到银的聚合物球体在电学,流变学和机械方面的性能,并与片状填充银的胶粘剂进行比较,证明了在ICA中使用涂银的聚合物球体作为导电填料的可行性和益处。此外,我们还报告了球体尺寸和涂层厚度对其电性能的影响。本文是对各种因素对填充有Ag涂层的MPS的ICA的电性能的影响进行的更为详尽的实验研究的结果。这些因素是MPS直径,由不同电镀工艺产生的银涂层的厚度和质量,粘合剂的固化条件以及粘合剂基质的类型。使用具有相同芯材但直径为10μm和30μm的涂有Ag的MPS进行了实验。结果表明,MPS的直径对粘合剂的电导率有重大影响。用较小的(10μm)球体配制的胶粘剂的导电率几乎是使用30μm的球体的两倍。对于相同尺寸的MPS,含有球形且Ag涂层较厚的粘合剂显示出较低的电阻率。当填料体积分数低于48%时,还可以观察到粘合剂基质对电阻率的显着影响。

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