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Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method

机译:使用Taguchi方法在22nm P型MOSFET中阈值电压的工艺参数统计优化

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This paper aims to study the effect of process parameter variation on a nano-scaled planar p-type MOSFET (metal-oxide-semiconductor field-effect transistor) device for 22 nm technology using Taguchi's L9 orthogonal array. The device was constructed with high-k/metal gate consisting of Titanium dioxide (TiO) and Tungsten silicide (WSix) metal gate using an industrial-based numerical simulator. Using Taguchi's Signal-to-noise ratio (SNR) of nominal-the-best (NTB), the compensation implantation has been as identified as the dominant factor influencing the Vth value with 67.77% while the Halo implantation tilting angle has been identified as the adjustment factor. Upon optimization, the V value is -0.29538 V which is within the requirements of the International Technology Roadmap for Semiconductors (ITRS) 2012 which is -0.289 V ± 12.7 %.
机译:本文旨在使用Taguchi的L9正交阵列研究22 nm技术的纳米缩放平面P型MOSFET(金属氧化物半导体场效应晶体管)装置的工艺参数变化的影响。使用基于工业的数值模拟器构成,用高k /金属栅极构成,由高k /金属栅极组成,由基于工业的数值模拟器组成的二氧化钛(TiO)和硅化物(WSIX)金属栅极。使用标签的最佳(NTB)的信噪比(SNR),补偿植入已被确定为影响VTH值的主要因素,而晕圈植入倾斜角度已被识别为调整因子。在优化时,V值为-0.29538 V,这在2012年国际技术路线图的要求范围内,这是-0.289 v±12.7%的半导体(ITRS)。

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