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Body doping analysis of vertical strained-SiGe Impact Ionization MOSFET incorporating dielectric pocket (VESIMOS-DP)

机译:包含电介质袋(VESIMOS-DP)的垂直应变SiGe冲击电离MOSFET的体掺杂分析

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The Vertical Strained Silicon Germanium (SiGe) Impact Ionization MOSFET with Dielectric Pocket (VESIMOS-DP) has been successfully developed and analyzed in this paper. There are significant drop in subthreshold slope (S) while threshold voltage is increase as the body doping concentration increases. It is notable that for body doping concentration above 1020, the S values keep increasing which is not recommended as the switching speed getting higher distracting performance of the device. An improved stability of threshold voltage, VTH was found for VESIMOS-DP device of various DP size ranging from 20nm to 80nm. The stability is due to the reducing charge sharing effects between source and drain region. In addition, the output characteristic was also highlighted a very good drain current at different gate voltage with the increasing of drain voltage for VESIMOS-DP with high body doping concentration. VESIMOS-DP with low body doping concentration suffers PBT effect that prevents the device from being able to switch off. Hence, high body doping concentrations are imperative for obtaining better device characteristics and ensure the device works in II mode.
机译:本文成功开发并分析了带有电介质袋的垂直应变硅锗(SiGe)冲击电离MOSFET(VESIMOS-DP)。当阈值电压随着人体掺杂浓度的增加而增加时,亚阈值斜率(S)明显下降。值得注意的是,对于高于10 20 的人体掺杂浓度,S值会不断增加,不建议这样做,因为开关速度会提高设备的分散性能。对于各种DP尺寸从20nm至80nm的VESIMOS-DP器件,发现阈值电压VTH的稳定性得到了改善。稳定性归因于源极和漏极区域之间电荷共享效应的降低。此外,对于高体掺杂浓度的VESIMOS-DP,随着栅极电压的增加,在不同的栅极电压下,输出特性也得到了很好的漏极电流。具有低主体掺杂浓度的VESIMOS-DP具有PBT效应,可防止器件关闭。因此,为了获得更好的器件特性并确保器件以II模式工作,必须采用高掺杂浓度。

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