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STRUCTURAL TESTING OF HIGH-SPEED SERIAL BUSES: A CASE STUDY ANALYSIS

机译:高速串行公交车的结构测试:案例研究分析

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As the speed of serial buses breaks into multi-gigabits per second (Gb/S), current structural testing methodologies break down. Direct physical access to buses is becoming impossible due to board layout constraints. Even when access is achievable, the signal measured at the probe point may be significantly different than the signal received at the chip. In addition, when a probe can be placed on a test point, the added capacitance caused by the probe can distort the signal, masking design problems or reporting erroneous faults. Because these difficulties will only increase as bus speeds increase and as more buses lose physical access, engineers are faced with identifying alternative strategies for maintaining sufficient test coverage. Recognizing this situation, Intel developed a technology called Intel Interconnect Built-In Self Test (Intel IBIST) [1, 2], which is being embedded into next-generation processors and chipsets. This case study examines the use of Intel IBIST to test circuit boards on an Intel based server. To perform the experiments, the Intel IBIST facilities were accessed via the board's boundary-scan (IEEE 1149.1/JTAG) port. Data was gathered to validate fault detection and diagnostics. In addition, data generated by the experiment are compared with current methods of testing, such as probing with an oscilloscope.
机译:随着串行总线的速度突破到每秒多千兆位(GB / s),当前的结构测试方法分解。由于板布局限制,直接物理访问公共汽车就变得不可能。即使当可获得访问时,在探测点测量的信号也可以显着不同于芯片处接收的信号。另外,当探头可以放置在测试点上时,由探头引起的添加电容可以扭曲信号,掩蔽设计问题或报告错误的故障。因为这些困难只会随着总线速度的增加而增加,并且随着更多的公共汽车失去物理访问,工程师面临着识别维持足够的测试覆盖的替代策略。认识到这种情况,英特尔开发了一种称为Intel Interconnect内置自检(英特尔IBist)[1,2]的技术,该技术正在嵌入到下一代处理器和芯片组中。本案例研究探讨了英特尔IBist在基于英特尔的服务器上测试电路板的使用。为了执行实验,通过电路板的边界扫描(IEEE 1149.1 / JTAG)端口访问英特尔IBist设施。收集数据以验证故障检测和诊断。此外,通过实验产生的数据与当前的测试方法进行比较,例如用示波器探测。

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