The mechanism of structural test simultaneously and serial of integrated circuits on silicon wafer and test procedure simultaneously and serial structural integrated circuits on silicon wafer.

摘要

The mechanism of structural test simultaneously and serial of integrated circuits on silicon wafer and test procedure simultaneously and serial structural integrated circuits on silicon wafer.The new mechanism and procedure for structural testing of integrated circuits in parallel and serial silicon wafer (wafer), which proposes a complete solution.Simple and low cost for testing of integrated circuits which enables the realization of structural test simultaneously by several circuits in a wafer.Keeping the capacity of any test serial of these circuits.Dramatically reducing the time of production test of integrated circuits which is currently very high and that causes a great impact on the cost of the same.With the proposal to reduce the test time of production of integrated circuits.Through the simultaneous execution of the structural testing of various integrated circuits; reduce the cost of integrated circuits.By reducing the test time of production; to increase the competitiveness of products, through the reduction of cost, reduce the time to sale (? Time to market?) ,Through the use of the same mechanism of test to test for prototyping (bringup) and production; and to increase the flow of testadora of integrated circuits.Through the simultaneous execution of structural tests.