首页> 外文会议>China Semiconductor Technology International Conference >Advanced process equipment matching methodology in semiconductor manufacturing
【24h】

Advanced process equipment matching methodology in semiconductor manufacturing

机译:半导体制造中的先进过程设备匹配方法

获取原文

摘要

The typical features in semiconductor manufacturing are complex processes, varieties of tools and tremendous data. In a mega FAB, hundreds of products are processing on thousands of tools, which request the consistency between manufacturing tools (no matter same type tools or different type tools) on the same process stage, called process equipment matching. This paper tries to explain how to set up a high efficiency and accuracy evaluation methodology on process equipment matching with mechanism and real practice. Meanwhile, the systematical application of this methodology is presented on this paper.
机译:半导体制造中的典型特征是复杂的工艺,工具品种和巨大数据。在Mega Fab中,数百种产品正在处理成千上万的工具,该工具请求在同一过程阶段的制造工具(无论同样类型工具或不同类型工具)之间的一致性,称为过程设备匹配。本文试图解释如何在与机制和实践匹配的过程设备上建立高效率和准确性评估方法。同时,本文提出了该方法的系统应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号