Concurrent and Collaborative Design in Package and Surrounding System, the Good Way to Make High-End SoC Design Successful: A Case Study of Availink SoC Package and System Board Design, Interactively with Die Physical Design

摘要

In complex SoC design, the higher performance and compact package would often cause tremendous problems with signal integrity - simultaneous switching noise issues, crosstalk issues, and resonance issues. Therefore, to design the chip, the package and its system concurrently can draw out all critical constraints simultaneously to all parties (chip, package and system design teams). In the process, a single interactive database is essential to allow design teams perform high speed interconnect analysis at both physical and electrical levels and make optimization tradeoffs among all levels. Meanwhile, the methodology also supports collaborative designs among fabless design house, package house and printed circuit board design suppliers. A case study of Availink SoC package and system board design listed the issues faced and explored the methodology described above and compared both critical signals simulation and physical test results. Finally a general flow of concurrent and collaborative design with simple analysis, as a comparison to conventional way, is given.