Packaging materials represent over a US$22 billion market to the companies supplying these materials to the semiconductor industry, and it is a market that has experience remarkable change with the introduction of new materials and for some packages a complete change in the material set over the past number of years. The surge in new packaging form factors recent years attest to the importance of semiconductor packaging in delivering increased functionality in a small form factor. Numerous new materials have been developed and introduced for these applications to improve reliability, to respond to environmental concerns, and to reduce costs. New material developments include low cost mold compounds and underfills compatible with devices fabricated with Iow-κ dielectrics; cost effective die attach films for die stacking and thin wafer handling; fine pitch laminate substrates; copper bonding wire; and more.
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