Development of a Standard Evaluation System to Characterize And Quantify PAD Foam Morphology for Chemical Mechanical Polishing (CMP)

摘要

The polishing pad plays a key role in the Chemical mechanical polishing (CMP) process. The pad's mechanical behavior for polishing and conditioning is highly related to its foam morphology. An innovative standard evaluation system to characterize and quantify pad foam morphology is proposed in this paper for the first time. Several criteria such as pore shape, size and density etc. are developed to quantify pad morphological properties. A typical CMP pad (IC1000) is chosen to demonstrate the feasibility of the evaluation system. Results show that the proposed system is effective to determine the pad morphological properties quantitatively.