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XPS Analysis of Gallium Nitride Film After O2/BCL3 Digital Etch

机译:O2 / BCL3数字蚀刻后氮化镓膜XPS分析

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Oxygen as modification gas for the first step, boron trichloride for the etch step was used to sequentially remove GaN from sapphire for 20 cycles. The relationship between oxidation and etching parameters with etching depth of each cycle was investigated. For 9 s etching time per cycle, the etch rate increased from 0.39 to 1.04 nm/cycle by increasing oxidation time from 0 to 20 s, and remained fairly constant with higher oxidation time revealing a self-limiting oxidation. The surface chemistry of GaN was investigated by X-ray photoelectron spectroscopy after ICP oxidation. A comprehensive analysis of oxygen chemisorption on GaN films with different oxidation time and possible mechanisms were discussed.
机译:作为第一步的改性气体作为改进气体,用于蚀刻步骤的硼三氯化物依次从蓝宝石中依次去除20个循环的GaN。研究了每个循环的蚀刻深度的氧化与蚀刻参数之间的关系。对于每个循环的9秒蚀刻时间,通过将氧化时间从0到20 s增加,蚀刻速率从0.39增加到1.04nm /循环,并且随着更高的氧化时间显示自限制氧化,仍然相当恒定。在ICP氧化后,通过X射线光电子体光谱研究了GaN的表面化学。讨论了不同氧化时间和可能机制的GaN薄膜氧气化学综合分析。

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