Warpage Control Method in Epoxy Molding Compound

摘要

For asymmetric packaging, especially for one-side molded packages, the mismatch between EMC's CTE and substrate (PCV or leadframe) can lead to different degrees of package warpage. The extent of warpage also depends on package designs like package size, package thickness, chip size and etc. This paper discusses the factors that affecting the package warpage, the warpage control method from epoxy molding compound, and the packaging process parameters. The results show the package mold cap, transfer pressure and the weight of the post-curing blocks can affect the final warpage. Epoxy molding compound can control the package warpage by using stress modifier, amount of filler loading and Tg value.