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Reflow Soldering for the Microwave Experimenter

机译:微波实验仪的回流焊

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Surface Mount Technology (SMT) and microwave electronics are synonymous. The need for low parasitic packaging long ago forced component manufacturers to adopt SMT packaging techniques. Since the mid-1990s the commercial success of cellular telephone and wireless data services have resulted in substantial investment into package development for smaller size and lower cost in addition to higher performance. The result is that there are now a huge number of very interesting parts available to hobbyists that have one fatal flaw - they cannot be soldered to a printed circuit board using a soldering iron. This one gotcha has prevented many hams from experimenting with microwave circuits capable of all kinds of fun.
机译:表面贴装技术(SMT)和微波电子学是同义词。很早以前就需要低寄生封装,这迫使​​元件制造商采用SMT封装技术。自1990年代中期以来,蜂窝电话和无线数据服务的商业成功已导致对封装开发的大量投资,以实现更小尺寸和更低的成本以及更高的性能。结果是,现在有大量非常有趣的零件可供业余爱好者使用,这些零件有一个致命的缺陷-无法使用烙铁将它们焊接到印刷电路板上。这一陷阱使许多火腿无法尝试具有各种乐趣的微波电路。

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