Study of the uniformity of 300mm wafer through ring- resonator analysis

机译：通过环形谐振腔分析研究300mm晶圆的均匀性

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The uniformity of a 300mm wafer has been analyzed through the study of resonant wavelength of ring resonators. SOI thickness variation can be compensated with the use of Ti-TiN heater.

机译：通过研究环形谐振器的谐振波长，分析了300mm晶片的均匀性。 SOI厚度的变化可以通过使用Ti-TiN加热器来补偿。

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《International Conference on Photonics in Switching》|2012年|1-3|共3页
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Chauveau C.; Labeye P.; Fedeli J.-M.; Blaize S.;
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Study of the uniformity of 300mm wafer through ring- resonator analysis

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