Substrate choice is critical for overall flexibleelectronic device and process optimization.Compared to alternatives, glass substrates offeradvantages of dimensional and thermal stability,hermeticity, transparency, and surface quality. Thispaper discusses Corning? Willow? Glassproperties that enable high-performance devicesusing roll-to-roll (R2R) processes. Demonstrationsof R2R flexible glass processes such as ITOdeposition, photolithography, laser patterning,screen printing, and lamination will be described.These basic capabilities enable high-qualitydevices on Willow Glass substrates.
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