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4H-SiC SOI-MESFET with a step in buried oxide for improving electrical performance

机译:4H-SiC SOI-MESFET,具有掩埋氧化物步骤,可改善电性能

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This paper introduces a novel 4H-SiC SOI-MESFET with a step in buried oxide (SSOI-MESFET) for improving breakdown voltage. We investigate the improvement in device performance with two-dimensional and two-carrier device simulation. Our simulation results show that breakdown voltage of SSOI-MESFET is higher than conventional Bulk-MESFET (CB-MESFET) and conventional 4H-SiC SOI-MESFET (CSOI-MESFET). In this study we have shown that saturation current of the proposed structure is higher than CB-MESFET.
机译:本文介绍了一种新颖的4H-SiC SOI-MESFET,其具有埋入式氧化物台阶(SSOI-MESFET),可提高击穿电压。我们通过二维和两载流子设备仿真研究设备性能的提高。我们的仿真结果表明,SSOI-MESFET的击穿电压高于常规的Bulk-MESFET(CB-MESFET)和常规的4H-SiC SOI-MESFET(CSOI-MESFET)。在这项研究中,我们证明了所提出结构的饱和电流高于CB-MESFET。

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