Electronic circuit patterning on curved surface by direct laser structuring

摘要

In this paper we report direct laser structuring technology for circuit patterning. The laser structuring could replace photolithography and additional processes for manufacturing printed circuit board. The laser structuring can be divided into three steps, injection molding with polymer composite materials, laser emission and electroless plating. These cost-effective three steps could simplify more than 10 steps in photolithographic process, alternatively. The laser structuring has an advantage in curved surface application. Experimental results show that the direct structuring with a power-stabilized pulsed nanosecond laser can be applied for 3-dimensional circuit patterning.