Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

摘要

Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic simulations whereas the second one is based on circuit simulations. Finally, promising experimental studies were done in order to demonstrate the principle of the CNTs based flip-chip interconnect.