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Low power memory implementation for a GHz+ Dual Core ARM Cortex A9 processor on a high-K metal gate 32nm low power process

机译:在高K金属门32nm低功耗工艺上实现GHz +双核ARM Cortex A9处理器的低功耗存储器实现

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Dynamic power is a keenly analysed design parameter in SRAM memory design especially in low power battery operated systems. A simple way to reduce dynamic power (and leakage power) is to lower the operating voltage to the minimum possible for a given operating speed requirement. The transistor threshold voltages ultimately define the lowest operating voltage possible but memory circuits have a number of specific issues which usually limit minimum operating voltages to higher then the theoretical minimum. One such issue is the write operation to a standard 6T SRAM bit cell. This paper explains the techniques and write assist circuits used in the level 1 cache sub-system in a GHz+ Dual Core ARM Cortex A9 CPU on a 32nm LP process [1] to support low voltage operation. Two independently enabled techniques are implemented; a supply boosting scheme to drive the memory above the nominal supply voltage and a novel voltage lowering scheme to reduce the voltage supply to the bit cells. Both are discussed and the improvement in minimum functional operating voltage is reported.
机译:动态功率是SRAM存储器设计中经过认真分析的设计参数,尤其是在低功耗电池操作系统中。降低动态功率(和泄漏功率)的一种简单方法是将操作电压降低到给定操作速度要求下的最小可能值。晶体管阈值电压最终定义了可能的最低工作电压,但是存储电路存在许多特定问题,这些问题通常将最低工作电压限制为高于理论最低值。这样的问题之一是对标准6T SRAM位单元的写操作。本文介绍了在32nm LP工艺[1]上支持GHz +操作的GHz +双核ARM Cortex A9 CPU的1级缓存子系统中使用的技术和写辅助电路。实现了两种独立启用的技术;提供一种将存储器驱动到标称电源电压之上的电源提升方案,以及一种新颖的降低电压方案以降低向位单元的电压供应。都进行了讨论,并报告了最小功能工作电压的提高。

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