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Pulsed UV-Laser Processing of Amorphous and Crystalline Group Ⅳ Semiconductors

机译:非晶和晶体Ⅳ族半导体的脉冲紫外激光加工

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In the last decade, UV-Excimer laser systems have been dramatically improved in terms of beam quality, power stability and gas lifetime. The benefits of using them for group Ⅳ semiconductor processing have, up to now, principally been recognized for some few processes like laser marking, UV-lithography and Excimer Laser Crystallization (ELC). Although several other techniques like Laser induced Chemical Vapor Deposition (LCVD), Excimer Laser Annealing (ELA) and Pulsed Laser Induced Epitaxy (PLIE) have been extensively studied 30 years ago for producing silicon coatings, little is known about the prospects of up-scaling those processes to other group Ⅳ semiconductors. This contribution presents UV-Laser processes combining LCVD of amorphous Si and of SiGeC alloys with their subsequent laser, in particular PLIE, treatment for modifying their composition and structure in order to engineer lattice parameters.
机译:在过去的十年中,紫外线准分子激光系统在光束质量,功率稳定性和气体寿命方面得到了显着改善。到目前为止,基本上已经将它们用于Ⅳ组半导体工艺的好处已经在一些工艺中得到了认可,例如激光打标,UV光刻和准分子激光结晶(ELC)。尽管30年前已经广泛研究了其他一些技术,例如激光诱导化学气相沉积(LCVD),准分子激光退火(ELA)和脉冲激光诱导外延(PLIE),以生产硅涂层,但对于扩大规模的前景知之甚少那些工艺转移到其他Ⅳ族半导体上。这种贡献提出了将非晶硅和SiGeC合金的LCVD与随后的激光(特别是PLIE)处理相结合的UV激光工艺,以改变其成分和结构,从而设计晶格参数。

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