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Pulsed UV-Laser Processing of Amorphous and Crystalline Group IV Semiconductors

机译:无定形和结晶族IV半导体的脉冲紫外线激光加工

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In the last decade, UV-Excimer laser systems have been dramatically improved in terms of beam quality, power stability and gas lifetime. The benefits of using them for group IV semiconductor processing have, up to now, principally been recognized for some few processes like laser marking, UV-lithography and Excimer Laser Crystallization (ELC). Although several other techniques like Laser induced Chemical Vapor Deposition (LCVD), Excimer Laser Annealing (ELA) and Pulsed Laser Induced Epitaxy (PLIE) have been extensively studied 30 years ago for producing silicon coatings, little is known about the prospects of up-scaling those processes to other group IV semiconductors. This contribution presents UV-Laser processes combining LCVD of amorphous Si and of SiGeC alloys with their subsequent laser, in particular PLIE, treatment for modifying their composition and structure in order to engineer lattice parameters.
机译:在过去的十年中,在光束质量,功率稳定性和气体寿命方面已经显着改善了UV-Consimer激光系统。使用它们对于第四组半导体处理的优点,最多几乎已经识别出激光标记,UV光刻和准分子激光结晶(ELC)等一些方法。虽然在30年前,在30年前已经过度研究了几种其他技术,例如激光诱导的化学气相沉积(LCVD),准分子激光退火(ELA)和脉冲激光诱导的外延(PLIE),但是为了生产硅涂料,对升高的前景知之甚少其他第四组半导体的过程。该贡献呈现UV-激光方法,将无定形Si和Sigec合金的LCVD与其随后的激光器,特别是PLIE,用于改变它们的组成和结构以改造晶格参数。

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