Modeling of Mismatch and Across-Chip Variations in Compact Device Models

摘要

Pelgrom characterized device mismatch between two devicesseparated by a finite distance D_(ij) as (a~2/WL + b~2D_(ij)~2)~(1/2).While the modeling of adjacent mismatch (D_(ij)≈ 0) in compact models is straightforward, the modeling of distance-dependent mismatch (D_(ij) > 0) among several devices remains a challenge. Further, mismatch and intra-die/across-chip variations (ACV) are generally treated as two separate problems. In this paper, for the first time, we (ⅰ) link characterizations among adjacent mismatch, finite-distance mismatch, ACV, and correlation into a unified concept and description and improve Pelgrom's mismatch characterization, (ⅱ) highlight the challenges in implementing Pelgrom's distance-dependent mismatch characterization in compact models, and (ⅲ) present a set of compact solutions for modeling mismatch and ACV.