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A 5V/200V SOI device with a vertically linear graded drift region

机译:具有垂直线性渐变区域的5V / 200V SOI器件

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The dependence of the avalanche breakdown voltage on vertically linear doping gradient of the drift region based on Silicon-On-Insulator (SOI) lateral diffuse metal oxide semiconductor (LDMOS) is studied. Vertically linear doping profile (VD) of the LDMOS structure is exhibited to obviously improve safe of operation area (SOA) from the conventional uniform and variable linear doping structure. From the BFOM (Baliga''s Figure of Merits), optimal relationship between breakdown voltage and on-state resistance (RonA) is found. The simulation results the breakdown voltage of the VD SOI LDMOS device can be improved by 19%,and 35% and the on-state resistance can be lowered by 19% and 29% at 2µm and 3µm over conventional. A 200 V LDMOS transistor with RonA of less than 800 mΩ-mm2 based on various SOI layers is reported.
机译:研究了基于绝缘体上硅(SOI)横向扩散金属氧化物半导体(LDMOS)的雪崩击穿电压对漂移区垂直线性掺杂梯度的依赖性。与传统的均匀可变线性掺杂结构相比,LDMOS结构的垂直线性掺杂分布(VD)可以显着提高操作区域(SOA)的安全性。从BFOM(Baliga的品质因数)中,可以找到击穿电压和导通电阻(RonA)之间的最佳关系。仿真结果表明,与传统技术相比,VD SOI LDMOS器件在2μm和3μm的击穿电压可提高19%和35%,导通电阻可分别降低19%和29%。报告了基于各种SOI层的RonA小于800mΩ-mm 2 的200 V LDMOS晶体管。

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