首页> 外文会议>Proceedings of the 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems >Fabrication and performance of Microplasma Reactor for maskless scanning plasma etching
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Fabrication and performance of Microplasma Reactor for maskless scanning plasma etching

机译:用于无掩模扫描等离子体刻蚀的微等离子体反应器的制备和性能

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A Microplasma Reactor for maskless microano plasma etching system based on parallel probe actuation is proposed. The microplasma reactor, having (50μm) or (100μm) inverted pyramidal hollow cathode and metal/dielectric/metal sandwich structure, is successfully fabricated here. Measurement system is set up to test the electrical and optical property of the device. Experiment results show that the device discharges stably in SF6, and the breakdown voltages of the device obey Paschen''s law. V-I characteristics of the device for several gas pressures, source voltages, ballast resistors are also presented. Emission spectras of SF6 at low pressures show F atom lines, which are available for etching silicon and so on.
机译:提出了一种基于平行探针驱动的无掩模微纳等离子体刻蚀系统微等离子体反应器。在此成功制备了具有(50μm)或(100μm)倒置金字塔形空心阴极和金属/电介质/金属夹心结构的微等离子体反应器。设置了测量系统以测试设备的电气和光学性能。实验结果表明,该器件在SF6中稳定放电,其击穿电压符合Paschen定律。还介绍了该设备在多种气压,电源电压,镇流电阻器下的V-I特性。低压下SF 6 的发射光谱显示F原子线,可用于蚀刻硅等。

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