Tungsten Plug Missing Defects Monitoring Method and Its Solution by Optimization of Polymer Cleaning and Micro-environment

摘要

This paper describes the tungsten (W) missing defects monitoring method with electron-beam inspection systems, and its solution by optimization of polymer cleaning and micro-environment. W missing defects detection and monitoring method was developed and fixed on bare silicon wafer. Then a series of experiments was carried out, and W missing defects were fixed by the optimization of polymer cleaning and micro-environment of the front side open unit port (FOUP).