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Post-silicon debugging for multi-core designs

机译:用于多核设计的硅后调试

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Escaped errors in released silicon are growing in number due to the increasing complexity of modern processor designs and shrinking production schedules. Worsening the problem are recent trends towards chip multiprocessors (CMPs) with complex and sometimes non-deterministic memory subsystems prone to subtle, devastating bugs. This deteriorating situation is causing a growing portion of the validation effort to shift to post-silicon, when the first few hardware prototypes become available and where validation experiments are run directly on newly manufactured prototype hardware. While post-silicon validation enables much higher raw performance in test execution, it is a much more challenging environment for bug diagnosis and correction. In this work we briefly overview some of the current methodologies used in industry. We then discuss some recent ideas developed in our research group to leverage the performance advantage of post-silicon validation, while sidestepping its limitations of low internal node observability and expensive bug fixing. Finally we present some of today's general trends in post-silicon validation research.
机译:由于现代处理器设计的复杂性不断提高和生产计划缩短,释放出的硅片中的逃逸错误越来越多。使问题更加恶化的是,近来趋向于带有复杂的,有时不确定的存储子系统的芯片多处理器(CMP),这些子系统容易产生细微的破坏性错误。当最初的几个硬件原型可用并且在新制造的原型硬件上直接运行验证实验时,这种不断恶化的情况导致越来越多的验证工作转移到后硅上。尽管硅后验证可以在测试执行中提供更高的原始性能,但对于错误诊断和纠正而言,这是一个更具挑战性的环境。在这项工作中,我们简要概述了行业中使用的一些当前方法。然后,我们讨论在我们的研究小组中开发的一些新想法,以利用后硅验证的性能优势,同时回避其内部节点可观察性低和错误修复成本高的局限性。最后,我们介绍了后硅验证研究的当今一些一般趋势。

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