Industrial PCB Development using Embedded Passive Active Discrete Chips Focused on Process and DfR

摘要

For several years, 3D-integration approaches have been explored to keep pace with the continuous trends towards electronics miniaturization and densification. Numerous technologies issued from various chip-, package- or board-level concepts can now be used and combined to achieve highly integrated "smart" systems. PCB embedding of passive and active devices is one of these advanced options with a strong potential : it enables a dramatic functionality increase while maintaining key PCB attributes of component and interconnects carrier. The presented paper will discuss some aspects of the PCB embedding technology developed in the frame of the HERMES project (High density integration by Embedding chips for Reduced size Modules and Electronic Systems). This European funded FP7 3 years research program targets to establish an industrial platform capable of producing PCBs with 2 layers of embedded components including large die sizes. The embedded PCBs manufactured will then be populated with external SMD components on both sides to constitute complex high-end integrated modules able to withstand conventional repair operations and ensuring a high reliability level. The work carried out will support the design and manufacturing of the various HERMES functional demonstrators for security, automotive and power module applications.