Precision machining of silicon wafers using multi-cutters

摘要

The majority of integrated circuits are constructed on silicon wafers nowadays. Precision machining process has great potential to improve wafer quality at a low cost, this paper addressed a new method of machining silicon wafers and its general mathematical model to predict the locus of the machining lines and the distance between two adjacent machining lines using multi-cutters simultaneously. Mathematical expression of machining model was derived, experimental results on experimental device prove feasibility of this new machining method with multi-cutters.