Machining characteristics on the ultra-precision dicing of silicon wafer

摘要

Recently, the slightest damage to a circuit can cause great damage due to the sizes of semiconductor chips becoming smaller. To prevent damage to the circuit, the dicing process for silicon wafer must be controlled. In this study, the relationship between the chipping effect and the force of dicing was analyzed. The rate of chipping decreased with a decrease in the force of dicing. The force of dicing also decreased according to a lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve a chip-free process.