Development of expert decision model to monitor precision of solar silicon wafer machine line

摘要

In this study, we develop a two-stage decision model for managing uncertainty and imprecision of solar silicon wafer slicing evaluations during a wafer manufacturing process. Stage 1 is the evaluation process, which is performed by a procedure based on a combination of the fuzzy analytic hierarchy process (AHP) and the TOPSIS method. Stage 2 is the verification process, in which process capability indices are calculated to verify the feasibility and effectiveness of the proposed methods.