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Physical properties of thin nanoimprint polymer films measured by photoacoustic metrology

机译:通过光声计量学测量的纳米压印聚合物薄膜的物理性质

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The implementation of nanoimprint lithography as a nanoscale manufacturing technique for features below 50 nm requires accurate values for the physical properties of the polymers, such as Young's modulus, used in this fabrication process. These affect the flow of polymer during imprinting, and determine the strength and stability of the polymer structures that are produced. Most physical parameter values used for nanoimprinting are taken from bulk measurements. However below 100 nm, physical properties can change significantly due to the increased importance of surface and interface effects, and the confinement of polymer molecules. It order to measure directly the physical properties of samples with very small dimensions the ultrashort laser pulse photoacoustic method has been applied to layers of poly(methyl methacrylate) of thicknesses from 586 to 11 nm, spin-coated onto silicon wafers. Acoustic speeds, calculated from time of flight and film thicknesses as measured by ellipsometry, were found to increase below approximately 80 nm, with an increase of 20% for a 13 nm sample, compared to the bulk value. This corresponds to an increase in Young's modulus of 44%. It was found that when a layer of Hexamethyldisilazane (HMDS) adhesion promoter was spin-coated onto the silicon wafer, before the polymer, there was a much smaller increase in Young's modulus, of approximately 21%, at 16 nm thickness, which indicates that the increase is due to chemical effects at the interface. The photoacoustic process is numerically modelled to ensure a full analysis of the recorded signal.
机译:将纳米压印光刻技术实现为低于50 nm的特征的纳米级制造技术,需要在该制造过程中使用的聚合物物理特性(例如杨氏模量)的准确值。这些影响压印期间聚合物的流动,并确定所产生的聚合物结构的强度和稳定性。用于纳米压印的大多数物理参数值均来自批量测量。但是,在100 nm以下,由于表面和界面效应的重要性增加以及聚合物分子的限制,物理性质可能会发生显着变化。为了直接测量尺寸很小的样品的物理性能,超短激光脉冲光声法已应用于旋涂在硅片上的厚度为586至11 nm的聚(甲基丙烯酸甲酯)层。由飞行时间和通过椭圆光度法测量的薄膜厚度计算得出的声速发现增加到大约80 nm以下,与体积值相比,13 nm样品增加了20%。这对应于杨氏模量增加44%。结果发现,当在聚合物上旋涂六甲基二硅氮烷(HMDS)增粘剂层到硅片上时,在16 nm厚度时,杨氏模量的增加幅度要小得多,约为21%,这表明增加是由于界面处的化学作用。对光声过程进行数值建模,以确保对记录的信号进行全面分析。

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