Research Progress on Constitutive Model of Solder Joints in Micro-electronic Packing

摘要

The thermal-mechanical reliability of solder joints has been a key issue in the reliability assessment of electronic packaging.The recent developments in constitutive model of solder joints are summarized.Numerous constitutive models are proposed such as elastoplastic model,creep model,separated viscoplastic model,uniformed viscoplastic model and constitutive model based on fracture mechanics.At last,some suggestions for future investigations are also made.