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Realistic Projections of Product Fails from NBTI and TDDB

机译:产品的现实投影从NBTI和TDDB失败

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Statistical models for deconvolving the effects of competing mechanisms on product failures are presented. Realistic projections of product fails are demonstrated on high performance microprocessors by quantifying the contribution of NBTI, TDDB and extrinsic fail mechanisms. In particular, it is shown that transistor shifts due to NBTI manifest as population tails in the product's minimum operating voltage (Vmin) distribution, while TDDB manifests as single-bit or logic failures that constitute a separate sub-population. NBTI failures are characterized by Lognormal statistics combined with a slower degradation rate (△Vt ~ t{sup}0.15-t{sup}0.25), in contrast to TDDB failures that follow extreme-value statistics and exhibit a faster degradation rate (△Vt ~ t{sup}0.5).
机译:提出了解构竞争机制对产品故障的影响的统计模型。通过量化NBTI,TDDB和外在故障机制的贡献,在高性能微处理器上证明了产品故障的现实投影。特别地,结果表明,由于产品的最小工作电压(VMIN)分布中的群体尾部,由于NBTI表现出的晶体管移位,而TDDB以单位或逻辑故障表现为单独的子群。 NBTI故障的特点是Lognormal统计数据与较慢的降级速率(△Vt〜t {sup} 0.15-t {sup} 0.25)相比,与遵循极值统计的TDDB故障,并表现出更快的降级率(△VT 〜t {sup} 0.5)。

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