首页> 外文会议>Silicon Carbide and Related Materials 2007 >Effect of Recombination-Induced Stacking Faults on Majority Carrier Conduction and Reverse Leakage Current on 10 kV SiC DMOSFETs
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Effect of Recombination-Induced Stacking Faults on Majority Carrier Conduction and Reverse Leakage Current on 10 kV SiC DMOSFETs

机译:重组诱发的堆叠故障对10 kV SiC DMOSFET的多数载流子传导和反向漏电流的影响

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This paper presents the effect of recombination-induced stacking faults on the drift based forward conduction and leakage currents of high voltage 4H-SiC power devices. To show the effects, IV characteristics of a 4H-SiC 10 kV DMOSFET and a 4H-SiC 4 kV BJT have been evaluated before and after the induction of stacking faults in the drift epilayer. For both devices, significant increases in forward voltage drops, as well as marked increases in leakage currents have been observed. The results suggest that injection of minority carriers in majority carrier devices should be avoided at all times.
机译:本文介绍了重组诱导的堆垛机故障对高压4H-SIC电源装置的漂移基的前向传导和漏电流的影响。为了展示漂移脱落器中的堆叠故障诱导之前和之后评估了4H-SiC 10kV DMOSFET的IV特性和4H-SIC 4 kV BJT的效果。对于两个设备,已经观察到正向电压下降的显着增加,并且已经观察到漏电流的显着增加。结果表明,应始终避免在多数载体器件中注射少数载波。

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