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A modified TPP test structure for determining the specific contact resistance of the screen-printed Ag-metal contact of the silicon solar cell

机译:一种改进的TPP测试结构,用于确定硅太阳能电池的丝网印刷Ag-金属触点的比接触电阻

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A revised version of the contact resistance test structure based on the three-point probe method has been designed to determine the specific contact resistance, ¿c (¿ cm2) of the screen-printed Ag metallization on the top of the porous silicon surface of the solar cell. The contact structure consists of printed Ag metal contact on the top of the porous silicon surface and an aluminum/silver (Al/Ag) contact at the back surface which was realized by screen-printed metallization process. The three-point probe (TPP) method was used to determine the specific contact resistance measurement shows that a much reliable value of ¿c = 1.15×10-6 ¿-cm2 is estimated for the contact structure. This value of ¿c is two or more orders of magnitude lower than the corresponding specific contact resistance data previously reported for the Ag metallization on the porous silicon/p-Si heterostructure.
机译:已设计出基于三点探针法的接触电阻测试结构的修订版,以确定比接触电阻Â,,和。 / sup>)在太阳能电池的多孔硅表面的顶部进行丝网印刷的Ag金属化。接触结构由多孔硅表面顶部的印刷Ag金属接触和背面的铝/银(Al / Ag)接触组成,这是通过丝网印刷金属化工艺实现的。使用三点探针(TPP)方法确定比接触电阻的测量结果表明,一个非常可靠的值 c =1.15ƒ-10 -6 < / sup>×-cm 2 用于接触结构。的此值 c 比先前针对多孔硅/ p-Si异质结构上的Ag金属化所报告的相应的比接触电阻数据低两个或多个数量级。

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