首页> 外文会议>Electron Devices Meeting (IEDM), 2009 >A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (Φ-Flash), suitable for full 3D integration
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A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (Φ-Flash), suitable for full 3D integration

机译:堆叠式SONOS技术,多达4层和6nm晶体纳米线,具有全能门或独立门(Φ-Flash),适用于全3D集成

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We present the first experimental study of a Gate-All-Around (GAA) SONOS memory architecture with 4-level crystalline nanowire channels (down to 6 nm-diameter). The technology is also extended to an independent double gate memory architecture, called ¿-Flash. The experimental results with 6 nm nanowires show high programming windows (up to 7.4 V), making the structure compatible with multilevel operation. Excellent retention even after 104 cycles is achieved. The independent double gate option has otherwise been successfully integrated with 4-level stacked nanowires for multibit applications. The ¿-Flash exhibits up to 1.8 V ¿VTh between its two gates, demonstrating multibits operation. The basic process to fully disconnect the different nanowires in view of a full 3D integration of a memory array is discussed.
机译:我们目前对具有4级晶体纳米线通道(直径最小6 nm)的全能门(GAA)SONOS存储器体系结构进行了首次实验研究。该技术还扩展到了一个独立的双门存储架构,称为ƒ-Flash。 6 nm纳米线的实验结果显示了较高的编程窗口(最高7.4 V),从而使该结构与多级操作兼容。即使经过10 4 个循环,仍具有出色的保留率。否则,独立的双栅极选件已经成功地与4级堆叠纳米线集成在一起,用于多位应用。 Â-Flash的两个门之间的电压最高为1.8 V ÂV Th ,这说明了多位操作。讨论了基于内存阵列的完整3D集成完全断开不同纳米线的基本过程。

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