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Study and Application of No-Formaldehyde Electroless Copper Plating in PTH

机译:PTH中无甲醛化学镀铜的研究与应用

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The electroless copper plating process, which uses the formaldehyde as the reducing agent, is the most important process in PCB through-hole metallization. But it is well known that formaldehyde is harmful to people and environment. Some new electroless copper plating baths which use other green reducing agent were reported in these years. We studied the new baths which use sodium hypophosphite and glyoxylic acid, and the applications of these two baths in PTH. At the same time, we discussed the outlook of these new baths in PTH.
机译:使用甲醛作为还原剂的化学镀铜工艺是PCB通孔金属化中最重要的工艺。但是众所周知,甲醛对人和环境有害。近年来报道了一些使用其他绿色还原剂的新型化学镀铜浴。我们研究了使用次磷酸钠和乙醛酸的新型镀液,以及这两种镀液在PTH中的应用。同时,我们讨论了PTH中这些新浴池的前景。

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