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Uncooled amorphous silicon TEC-less 1/4 VGA IRFPA with 25 μm pixel-pitch for high volume applications

机译:非冷却的无硅无TEC的1/4 VGA IRFPA,具有25μm像素间距,适用于大批量应用

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The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 × 288 (1/4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application.This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range ...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production.We will present first the simple TEC-less operating mode which has been developed. The electro-optical characterization versus environmental temperature will be presented.
机译:ULIS和CEA / LETI在由非晶硅层制成的非制冷测微计上积累了丰富的专业知识,使ULIS能够开发384×288(1/4 VGA)IRFPA格式的IRFPA格式,像素间距为25μm,专为低端应用而设计。 该检测器保留了在完整TV格式ROIC上开发的所有创新(通过串行链接配置检测器,低功耗或宽动态范围...)。该单元的特别吸引力在于无TEC(热电冷却器)封装的小型化和极轻的重量。像素间距的减少和创新的封装使该阵列成为非常适合大规模生产的低成本产品。 我们将首先介绍已经开发的简单的无TEC操作模式。将介绍电光特性与环境温度的关系。

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