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Characterization of radio frequency sputtered Si_xGe_(1-x)O_y thin films for uncooled micro-bolometer

机译:射频溅射Si_xGe_(1-x)O_y非冷却微辐射热计薄膜的表征

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Thin film Si_xGe_(1-x)O_y were deposited on glass, silicon and SiO_2 by RF magnetron sputtering using co-sputtering of silicon and germanium targets in an environment of oxygen and argon. Silicon percentage was varied from ~7% to 22%. Exact contents of each material were determined by XRD/EDS and electrical properties of amorphous compound were studied. High values of temperature coefficient of resistance were obtained in specific conditions. the highest achieved TCR at room temperature was (5.8%/K) using Si_(0.177)Ge_(0.726)O_(0.097) (film deposited at 400 °C). The measured resistivity on this sample was 14.6 Ω cm.
机译:通过在氧和氩的环境中使用硅和锗靶材的共溅射,通过RF磁控溅射将薄膜Si_xGe_(1-x)O_y沉积在玻璃,硅和SiO_2上。硅含量从7%到22%不等。通过XRD / EDS测定每种材料的确切含量,并研究了非晶态化合物的电性能。在特定条件下可获得较高的电阻温度系数值。使用Si_(0.177)Ge_(0.726)O_(0.097)(薄膜在400°C沉积)在室温下获得的最高TCR为(5.8%/ K)。在该样品上测得的电阻率为14.6Ωcm。

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