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Hydrogen Incorporation of Metal Gate HfO_2 MOS Structures on In_(0.2)Ga_(0.8)As Substrate with Si Interface Passivation Layer

机译:具有Si界面钝化层的In_(0.2)Ga_(0.8)As衬底上金属栅HfO_2 MOS结构的氢结合

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Recently, we have investigated the GaAs MOSFKT and InGaAs MOS structure using Si interface passivation layer (IPL) and IlO_2 as gate dielectric. In this work, we have Investigated hydrogen incorporation effects for In_(0.2)Ga_(0.8)As MOSCAP using the same oxide of HfO_2 as gate insulator with Si IPL and U_2 annealing at 500°C for 30min. Excellent electrical characteristics with Low Wit (~2.8·10~(12)) with low frequency dispersion {< 0.1% and <10mV) has been obtained.
机译:最近,我们已经研究了使用Si界面钝化层(IPL)和IlO_2作为栅极电介质的GaAs MOSFKT和InGaAs MOS结构。在这项工作中,我们研究了In_(0.2)Ga_(0.8)As MOSCAP的氢掺入效应,该氧化物使用与栅极绝缘体相同的HfO_2氧化物和Si IPL,并且U_2在500°C退火30分钟。在低色散(〜2.8·10〜(12))下,具有低频率色散(<0.1%和<10mV),具有出色的电气特性。

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