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High-Temperature Electrical Characteristics of SPDT GaAs Switches with Copper Metallized Interconnects

机译:带铜金属互连的SPDT GaAs开关的高温电气特性

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Temperature-dependent electrical characteristics of a Copper metallized AlGaAs/InGaAs psedomophic high-electron-mobility transistor (PHEMT) Single-Pole-Double-Throw (SPDT) switches utilizing platinum (Pt, 70 nm) as the diffusion barrier is reported for the first time. The thermal threshold coefficients, defined as θV_(th)/θT, is of -0.25 mV/K from 300 to 500 K. The Cu metallized SPDT switches exhibited performance at the ambient of 380 K with insertion loss of less than 0.5 dB, isolation larger than 40 dB at 2.5 GHz. The copper metallized switches, with the excellent sub-threshold and high-temperature RF characteristics, shows good microwave performance and material stability for high temperature applications.
机译:首次报道了以铂(Pt,70 nm)作为扩散阻挡层的铜金属化AlGaAs / InGaAs拟晶高电子迁移率晶体管(PHEMT)单刀双掷(SPDT)开关的随温度变化的电学特性时间。在300至500 K范围内,定义为θV_(th)/θT的热阈值系数为-0.25 mV /K。Cu金属化SPDT开关在380 K的环境下表现出的性能,插入损耗小于0.5 dB,隔离在2.5 GHz时大于40 dB。铜金属开关具有出色的亚阈值和高温RF特性,在高温应用中显示出良好的微波性能和材料稳定性。

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