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A metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface
A metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface
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机译:用于铜互连的金属阻挡层,在金属阻挡层或铜/金属阻挡层界面处掺入了硅
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摘要
A copper interconnect having a barrier layer (106, 206). A metal barrier layer may be co-deposited with Si to form barrier (106) or a metal barrier layer may be deposited followed by surface treatment with a Si-containing ambient to form barrier (206). The copper (110) is then deposited over the said barrier layer (106,206) with good adhesion.
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