Applications of laser direct-write for embedding microelectronics

摘要

The use of direct-write techniques might revolutionize the way microelectronic devices such as interconnects, passives, IC's, antennas, sensors and power sources are designed and fabricated. The Naval Research Laboratory has developed a laser-based microfabrication process for direct-writing the materials and components required for the assembly and interconnection of the above devices. This laser direct-write (LDW) technique is capable of operating in subtractive, additive, and transfer mode. In subtractive mode, the system operates as a laser micromachining workstation capable of achieving precise depth and surface roughness control. In additive mode, the system utilizes a laser-forward transfer process for the deposition of metals, oxides, polymers and composites under ambient conditions onto virtually any type of surface, thus functioning as a laser printer for patterns of electronic materials. Furthermore, in transfer mode, the system is capable of transferring individual devices, such as semiconductor bare die or surface mount devices, inside a trench or recess in a substrate, thus performing the same function of the pick-and-place machines used in circuit board manufacture. The use of this technique is ideally suited for the rapid prototyping of embedded microelectronic components and systems while allowing the overall circuit design and layout to be easily modified or adapted to any specific application or form factor. This paper describes the laser direct-write process as applied to the forward transfer of microelectronic devices.