首页> 外文会议>Conference on Metrology, Inspection, and Process Control for Microlithography XXI pt.1 >Critical dimension measurements on phase-shift masks using an optical pattern placement metrology tool
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Critical dimension measurements on phase-shift masks using an optical pattern placement metrology tool

机译:使用光学图案放置计量工具在相移掩模上进行关键尺寸测量

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A useful extension of the optical mask pattern placement metrology is the measurement of critical dimensions (CD), exploiting the outstanding mechanical resolution and stability of a corresponding mask metrology machine. In particular the CD measurement on phase-shift masks (PSMs) poses a challenge on the optical measurement method. The paper presents measurements and the corresponding computational modeling of the setup with respect to illumination beam path (reflection, transmission), PSM properties and measurement optics for a dedicated edge detection method. Variables have been the focus variation of the edge position and the critical dimension of the pattern. Based on the modeling outcome the alignment and the illumination have been improved and verification measurements have been performed on various machines of the type Vistec LMS IPRO3. The paper presents the measurements, the modeling and the comparison to the practical measurement results for original and improved setup, showing the achievement of the envisaged 2-nm repeatability.
机译:光学掩模图案放置度量的有用扩展是对临界尺寸(CD)的测量,它利用了相应的掩模度量机器的出色的机械分辨率和稳定性。特别地,在相移掩模(PSM)上的CD测量对光学测量方法提出了挑战。本文针对专用边缘检测方法,针对照明光束路径(反射,透射),PSM特性和测量光学器件,介绍了设置的测量值和相应的计算模型。变量是边缘位置的焦点变化和图案的关键尺寸。根据建模结果,对准和照明得到了改善,并且在Vistec LMS IPRO3类型的各种机器上进行了验证测量。本文介绍了针对原始设置和改进设置的测量,建模以及与实际测量结果的比较,显示了预期的2 nm可重复性。

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