ASSEMBLY PROCESS TECHNOLOGY RESEARCH OF 0201 COMPONENTS ON LARGE SIZE PCB

摘要

0201 components have been used commonly in industry, in this paper, the large size PCB (340mm × 366.7mm) design including the pattern position accuracy, the different thermal mass of outer layer copper foils, unsymmetrical tracers of the pad for 0201 components were investigated. At the same time, effects of stencil aperture/thickness and the types of solder paste on 0201 assembly were also studied.