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Principle hessian direction based parameter reduction forinterconnect networks with process variation

机译:具有过程变化的互连网络的基于主Hessian方向的参数约简

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On behalf of the organizing committee, we would like to welcome you to the 9th International Workshop on System-Level Interconnect Prediction (SLIP'07), held on March 17-18, 2007 at the Dolce Lakeway Resort and Spa in Austin, Texas. >The SLIP workshop focuses on modeling and prediction of usable properties of optimized interconnect systems and their impact on system performance. Both theory and applications of interconnect prediction techniques are highlighted, with emphasis on applications to architectural and micro-architectural exploration, physical design, interconnect technology planning, and communication networks. In addition to the presentation of state-of-the-art papers in these fields, invited talks and tutorials by leading researchers aim to encourage dialogue between the architecture, physical design, and interconnect technology communities. >Following a rigorous review process, the program committee has selected an outstanding set of 12 papers forpublication in the proceedings and oral presentations at the workshop. The topics of selected papers cover a wide range of issues, including impact of new materials (e.g., low-k dielectrics, carbon nanotube bundles) on interconnect performance, congestion estimation and early interconnect characterization and planning, and the impact of process variation on interconnect performance. >In addition to the contributed papers, we continue the SLIP tradition of featuring in the technical program several distinguished invited speakers. This year Avinoam Kolodny from Technion will speak about networks on chips, Majid Sarrafzadeh from UCLA will give a tutorial on congestion prediction, and Charles Alpert from IBM Austin Research Laboratory will speak on physical synthesis.
机译:我们谨代表组委会欢迎您参加3月17日在美国举行的第9届系统级互连预测国际研讨会(SLIP'07) 2007年1月18日在得克萨斯州奥斯汀市的Dolce Lakeway渡假村和水疗中心。

SLIP研讨会的重点是优化互连系统的可用特性及其对系统性能的影响的建模和预测。重点介绍了互连预测技术的理论和应用,重点是在体系结构和微体系结构探索,物理设计,互连技术规划和通信网络中的应用。除了介绍这些领域的最新论文外,领先研究人员邀请的演讲和教程还旨在鼓励体系结构,物理设计和互连技术社区之间的对话。

在严格的审查过程中,计划委员会选择了一套出色的12篇论文进行发表,并在研讨会上进行了口头陈述。所选论文的主题涵盖了广泛的问题,包括新材料(例如,低k电介质,碳纳米管束)对互连性能的影响,拥塞估计以及早期互连特性和计划,以及工艺变化对互连的影响表演。

除了提供的论文外,我们还将继续SLIP的传统,即在技术计划中邀请几位杰出的演讲嘉宾。今年,来自Technion的Avinoam Kolodny将讨论芯片网络,来自UCLA的Majid Sarrafzadeh将提供有关拥塞预测的教程,而来自IBM奥斯汀研究实验室的Charles Alpert将讨论物理合成。

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