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A Comparative Study on Drop Test Performance of Fine Pitch BGA Assemblies Using Pb-free and Tin-lead Solders

机译：无铅锡铅焊料细间距BGA组件跌落测试性能的比较研究

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.865-874|共10页
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Dongji Xie; Rooney D.T.; Geiger D.; Shangguan D.;
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1. Drop test performance of BGA assembly using SAC105H solder sphere [J] . Weiping Liu, Ning-Cheng Lee, Simin Bagheri, Global SMT & Packaging: European Edition (Surface Mount Technology) . 2012,第7期

机译：使用SAC105H焊球的BGA组件的跌落测试性能
2. Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications [J] . G. J. Jackson, M. W. Hendriksen, R. W. Kay, Soldering & Surface Mount Technology . 2005,第1期

机译：用于倒装芯片组装应用的6型和7型无铅焊膏的超细间距模板印刷中的子工艺挑战
3. Investigation Of Mechanical Shock Testing Of Lead-free Sac Solder Joints In Fine Pitch Bga Package [J] . Y, T, Chin, Microelectronics reliability . 2008,第7期

机译：细间距Bga封装中无铅气囊焊接点机械冲击试验的研究
4. A Comparative Study on Drop Test Performance of Fine Pitch BGA Assemblies Using Pb-free and Tin-lead Solders [C] . Dongji Xie, Rooney D.T., Geiger D., Electronic Components and Technology Conference . 2006

机译：使用PB无锡和锡铅焊接细间距BGA组件的降液试验性能的比较研究
5. Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly [D] . Pan, Jianbiao 2000

机译：微型BGA和细间距表面贴装组件的锡膏模版印刷建模和工艺优化
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP [O] . Pan, Jianbiao, Tonkay, Gregory L., Storer, Robert H., 2004

机译：微型BGA和细间距QFP的锡膏模版印刷的关键变量

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