首页> 外文会议>Conference on Photomask Technology; 20060919-22; Monterey,CA(US) >Development of next generation mask inspection method by using the feature of mask image captured with 199 nm inspection optics
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Development of next generation mask inspection method by using the feature of mask image captured with 199 nm inspection optics

机译:利用199 nm检测光学器件捕获的掩模图像特性开发下一代掩模检测方法

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We have developed a mask inspection system using 199nm inspection light wavelength. This system performs transmission and reflection inspection processes concurrently within two hours per plate. By the evaluation result of mask images and inspection sensitivity, it is confirmed that the 199nm inspection system has the advantage over the system using 257nm and has the possibility corresponding to next generation mask inspection. Furthermore, advanced die-to-database (D-DB) inspection, which can generate high-fidelity of a reference image based on the CAD data for alternating phase shift mask (PSM) or tri-tone, is required for next generation inspection system, too. Therefore, a reference image generation method using two-layer CAD data has been developed. In this paper, the effectiveness of this method is described.
机译:我们开发了一种使用199nm检测光波长的掩模检测系统。该系统每块板在两个小时内同时执行透射和反射检查过程。通过掩模图像的评价结果​​和检查灵敏度,可以确认199nm检查系统相对于使用257nm的系统具有优势,并且具有与下一代掩模检查相对应的可能性。此外,下一代检查系统需要高级的芯片到数据库(D-DB)检查,该检查可以基于用于交替相移掩模(PSM)或三色调的CAD数据生成高保真的参考图像。 , 也。因此,已经开发了使用两层CAD数据的参考图像生成方法。在本文中,描述了该方法的有效性。

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