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Sub-spot size CO_2 laser micromachining of features in fused silica by V-groove etching

机译:V槽刻蚀对亚光子尺寸CO_2激光微加工熔融石英特征

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摘要

Ablation of fused silica using the Gaussian irradiance profile of the TEM_(00) mode of a CO_2 laser is a very efficient way for micromachining features up to ten times smaller than the beam diameter. A series of laser-etched V-grooves sequentially shifted in a given fashion can be used to micromachine simple or structured patterns on the surface of fused silica substrates. Surface gratings with a periodicity of 12 μm were produced using a CO_2 laser beam of 100 μm (1/e~2) in diameter. Rectangular wells 50 μm wide and 50 μm deep were also micromachined using the same technique with a radius of curvature of roughly 8 μm at the bottom edges. Although the resolution of the periodic pattern is not fully understood, it appears to be partly governed by the amount of material removal by the top portion of the Gaussian beam (tip processing), as well as a carefully controlled shifting of the etched V-grooves on the fused silica substrate. Physical mechanisms that could be at the origin of the V shape of the grooves are also discussed.
机译:使用Co_2激光器的TEM_(00)模式的高斯辐照曲线的熔融二氧化硅是微机械加工特性高达比光束直径小的十倍的非常有效的方式。一系列以给定的方式顺序移动的激光蚀刻的V槽可用于熔融二氧化硅基板表面上的微机械简单或结构化图案。使用直径为100μm(1 / e〜2)的CO_2激光束产生周期性为12μm的表面光栅。矩形孔50μm宽和50μm深度也使用相同的技术在底部边缘处的曲率半径大约为8μm的技术。虽然不完全清楚定期模式的分辨率,但是似乎部分地由高斯梁(尖端处理)的顶部除去的材料量,以及仔细控制蚀刻的V沟槽的换档在熔融二氧化硅衬底上。还讨论了可以处于凹槽的V形状的原点的物理机制。

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